Deep RIE Process Center

The Deep RIE Process Center (Room 2223) houses two DRIE systems for Silcon etch and a surface profiler for measurement.

Address:
Nanosystem Fabrication Facility (CWB)
Rm 2223, 2/F (Lift no. 23),
The Hong Kong University of Science & Technology
Clear Water Bay
Kowloon, Hong Kong

Click here for the enlarged version