TSV Process Laboratory

The TSV Process Laboratory (Room 2227) houses an electoplating equipment for metal deposition and polishers for wafer polishing.

Address:
Nanosystem Fabrication Facility (CWB)
Rm 2227, 2/F (Lift no. 23),
The Hong Kong University of Science & Technology
Clear Water Bay
Kowloon, Hong Kong

Click here for the enlarged version