工藝資訊
Cleanliness Levels of NFF (CWB) Equipment (Click HERE to download)
1. Thermal Diffusion and Implantation Module
2. Dry Etching and Sputtering Module
3. Wet Etching and CMP Module
4. Photolithography Module
Remark:
Blue : Equipment in NFF (CWB)-EC (EC-01000)
Black : Equipment in NFF (CWB)-Phase 2 (P2-01000 and P2-00100)
Green: Equipment in TSV Process Laboratory (Rm. 2227)
Red: Equipment in Deep RIE Process Center (Rm. 2223)
Brown: Equipment for Microfluidic Process in NFF (CWB)-Phase 2
Purple: Equipment in Nanofabrication Demonstration Laboratory (NDL) (Rm. 3114)
Training Type 1: Peer-to-peer training
Training Type 2: Self-learning with practice
Training Type 3: Training class
1. Thermal Diffusion and Implantation Module
Process code |
Location |
Equipment |
Cleanliness level |
Who operates |
Training type |
Cleaning |
CVD |
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| CVD-A2 | P2-01000 | LPCVD-A2 Doped Amor-Si | Clean | Staff | NA | A3+SRD-A |
| CVD-A3 | P2-01000 | LPCVD-A3 Amor-Si/Poly | Clean | Staff | NA | A3+SRD-A |
| CVD-B1 | P2-01000 | LPCVD-B1 Low-Stress Nitride | Clean | Staff | NA | A3+SRD-A |
| CVD-B2 | P2-01000 | LPCVD-B2 Nitride | Clean | Staff | NA | A3+SRD-A |
| CVD-B3 | P2-01000 | LPCVD-B3 LTO | Clean | Staff | NA | A3+SRD-A |
| CVD-EPI | P2-01000 | ET3000 Epitaxy | Clean | Staff | NA | A3+SRD-A |
| CVD-A4 | P2-01000 | LPCVD-A4 Si-Ge / Amor-Si / Poly | Semi-Clean | Staff | NA | B1+SRD-B D1 (dump-rinser) |
| CVD-B4 | P2-01000 | LPCVD-B4 LTO / PSG | Semi-Clean | Staff | NA | B1+SRD-B D1 (dump-rinser) |
| CVD-P3 | P2-01000 | Oxford PECVD | Semi-Clean | Qualified Lab User | Type 1 & 3 | B1+SRD-B D1 (dump-rinser) |
| CVD-P2 | P2-01000 | STS PECVD | Non-Standard | Qualified Lab User | Type 1 &2 | B1+SRD-B/D1 (dump-rinser)/F (dump-rinser) |
| CVD-CNT | P2-01000 | CNT PECVD | Non-Standard | Qualified Lab User | Type 1 & 3 | B1+SRD-B/D1 (dump-rinser)/F (dump-rinser) |
| CVD-ALD | P2-01000 | Oxford ALD | Non-Standard | Qualified Lab User | Type 1 & 3 | B1+SRD-B/D1 (dump-rinser)/F (dump-rinser) |
Thermal Diffusion |
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| DIF-C1 | P2-01000 | Diff. Furnace-C1 FGA Annealing | Non-Standard | Staff | NA | B1+SRD-B/D1 (dump-rinser)/F (dump-rinser) |
| DIF-C2 | P2-01000 | Diff. Furnace-C2 N Pre-Deposition | Clean | Staff | NA | A3+SRD-A |
| DIF-C3 | P2-01000 | Diff. Furnace-C3 P Pre-Deposition | Clean | Staff | NA | A3+SRD-A |
| DIF-D1 | P2-01000 | Diff. Furnace-D1 Dry Oxidation | Clean (Only for gate oxide) | Staff | NA | A3+SRD-A |
| DIF-A1 | P2-01000 | Diff. Furnace-A1 Anneal/Oxidation | Clean | Staff | NA | A3+SRD-A |
| DIF-D2 | P2-01000 | Diff. Furnace-D2 Dry/Wet Oxidation | Clean | Staff | NA | A3+SRD-A |
| DIF-D3 | P2-01000 | Diff. Furnace-D3 Annealing/Dry/Wet Oxidation | Non-Standard | Staff | NA | B1+SRD-B/D1 (dump-rinser)/F (dump-rinser) |
| DIF-R1 | P2-01000 | RTP-600S | Clean | Qualified Lab User | Type 1 & 3 | A3+SRD- A |
| DIF-F1 | P2-01000 | Diff. Furnace-F1 Annealing/Dry/Wet Oxidation | Semi-Clean | Staff | NA | B1+SRD-B D1 (dump-rinser) |
| DIF-C4 | P2-01000 | Diff. Furnace-C4 FGA Annealing | Semi-Clean | Staff | NA | B1+SRD-B D1 (dump-rinser) |
| DIF-R2 | P2-01000 | AG610 RTP | Semi-Clean | Qualified Lab User | Type 1 & 3 | B1+SRD-B D1 (dump-rinser) |
DIF-R3 |
EC-01000 |
AW610 RTP |
Non-Standard |
Qualified Lab User | Type 1 & 3 | M1(dump-rinser)+ N2 dry |
Implantation |
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| IMP-3000 | P2-01000 | CF-3000 Implanter | Clean/Semi-Clean | Staff | NA | |
2. Dry Etching and Sputtering Module
| * Remark: For Semi-Clean process of "Poly Etcher", please contact NFF (CWB) technicians. * Remark: For Semi-Clean process of "Oxford GaN-InP Etcher", please contact NFF(CWB) technicians. |
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Process
code |
Location |
Equipment |
Cleanliness level |
Who operates |
Training type |
Cleaning |
Dry Etching |
||||||
| DRY-AOE | P2-01000 | AOE Etcher | Clean | Qualified Lab User | Type 1 & 3 | |
| DRY-Si-1 | P2-01000 | DRIE Etcher #1 | Clean | Qualified Lab User | Type 1 & 3 | |
DRY-Si-2 |
Rm. 2223 |
DRIE Etcher #2 |
Clean/Semi-Clean |
Qualified Lab User | Type 3 | |
DRY-Si-3 |
Rm. 2223 |
DRIE Etcher #3 |
Non-Standard |
Qualified Lab User | Type 3 | |
| DRY-Poly | P2-01000 | Poly Etcher | Clean/Semi-Clean * | Qualified Lab User | Type 1 & 3 | |
| DRY-XeF2 | P2-01000 | XeF2 Silicon Etcher | Clean/Semi-Clean | Qualified Lab User | Type 1 & 3 | |
| DRY-Trion | P2-01000 | Trion RIE Etcher | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| DRY-Metal-1 | P2-01000 | AST Metal Etcher | Semi-Clean | Qualified Lab User | Type 3 | |
| DRY-Metal-2 | P2-01000 | Oxford Aluminum Etcher | Semi-Clean | Qualified Lab User | Type 3 | |
| DRY-GaN | P2-01000 | GaN Etcher | Non-Standard | Qualified Lab User | Type 1 & 3 | |
| DRY-GaN-2 | P2-01000 | Oxford GaN-InP Etcher | Semi-Clean * | Qualified Lab User | Type 1 & 3 | |
DRY-RIE-1 |
EC-01000 |
Oxford RIE Etcher |
Non-Standard |
Qualified Lab User | Type 1 & 3 | |
| DRY-RIE-2 | P2-01000 | NFF RIE Etcher | Semi-Clean | Qualified Lab User | Type 1 & 3 | |
DRY-Cleaner |
P2-01000 |
Diener Plasma Cleaner |
Non-Standard |
Qualified Lab User | Type 1 & 2 | Microfluidic user only |
Photoresist O2 Asher |
||||||
| DRY-PR-1 | P2-01000 | PS210 Asher | Clean | Qualified Lab User | Type 1 & 2 | |
| DRY-PR-2 | P2-01000 | IPC 3000 Asher #1 | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| DRY-PR-3 | P2-01000 | IPC 3000 Asher #2 | Non-Standard | Qualified Lab User | Type 1 & 2 | |
DRY-PR-4 |
EC-01000 |
IPC 3000 Asher #3 |
Non-Standard |
Qualified Lab User | Type 1 & 2 | |
| DRY-PR-5 | P2-01000 | IPC 3000 Asher #4 | Clean | Qualified Lab User | Type 1 & 2 | |
Sputtering & Evaporation |
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| SPT-3180 | P2-01000 | Varian 3180 Sputter | Semi-Clean | Staff | NA | |
| SPT-NSC3000 | P2-01000 | NSC3000 Sputter | Semi-Clean | Qualified Lab User | Type 1 & 3 | |
| SPT-CY1 | P2-01000 | NFF-CY Sputter #1 | Semi-Clean | Qualified Lab User | Type 1 & 3 | |
SPT-EV1 |
NDL-10000 |
Cooke Evaporator #1 |
Semi-Clean |
Qualified Lab User | Type 1 & 3 | |
| SPT-ARC | P2-01000 | ARC-12M Sputter | Non-Standard | Qualified Lab User | Type 1 & 3 | |
| SPT-CVC | P2-01000 | CVC-601 Sputter | Non-Standard | Qualified Lab User | Type 1 & 3 | |
SPT-EV2 |
EC-01000 |
Cooke Evaporator #2 |
Non-Standard |
Qualified Lab User | Type 1 & 3 | |
SPT-AST600 |
EC-01000 |
AST 600EI Evaporator |
Non-Standard |
Qualified Lab User | Type 1 & 3 | |
SPT-AST450 |
EC-01000 |
AST 450I Evaporator |
Non-Standard |
Qualified Lab User | Type 1 & 3 | |
3. Wet Etching and CMP Module
Process
code |
Location |
Equipmment |
Cleanliness Level |
Who operates |
Training type |
Remark |
CMP |
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| CMP-2 | P2-10000 | USI Wafer Cleaner | Clean | |||
CMP-3 |
Rm. 2227 |
Silicon Grinder |
Semi-Clean |
Qualified Lab User | Type 1 & 2 | |
CMP-4 |
Rm. 2227 |
Buehler Polisher #1 |
Semi-Clean |
Qualified Lab User | Type 1 & 2 | |
CMP-5 |
Rm. 2227 |
Buehler Polisher #2 |
Non-Standard |
Qualified Lab User | Type 1 & 2 | |
CMP-6 |
NDL-10000 |
GnP CMP |
Clean |
Staff | NA | |
Wet-station |
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| Wetstation A - Sulfuric Cleaning Station | ||||||
| WET-A1 | P2-01000 | A1: Sulfuric Cleaning (NFF reserved) | Clean | Qualified Lab User | Type 1 & 2 | |
| WET-A2 | P2-01000 | A2:HF:H20 (1:50) | Clean | Qualified Lab User | Type 1 & 2 | |
| WET-A3 | P2-01000 | A3: Sulfuric Cleaning | Clean | Qualified Lab User | Type 1 & 2 | ONLY for "Clean" furnace and RTP |
| SRD-A | P2-01000 | Spin Dryer-A | Clean | Qualified Lab User | Type 1 & 2 | |
| Wetstation B - Sulfuic Cleaning/Decontamination Station | ||||||
| WET-B1 | P2-01000 | B1:Sulfuric Cleaning | Clean | Qualified Lab User | Type 1 & 2 | NOT for "Clean" furnace and RTP |
| WET-B2 | P2-01000 | B2:HF:H20(1:50) | Clean | Qualified Lab User | Type 1 & 2 | |
| WET-B3 | P2-01000 | B3:Decontamination | Clean | Qualified Lab User | Type 1 & 2 | |
| SRD-B | P2-01000 | Spin Dryer-B | Clean | Qualified Lab User | Type 1 & 2 | |
| Wetstation C - Oxide/Nitride Etching Station | ||||||
| WET-C1 | P2-01000 | C1:Nitride Strip | Clean | Qualified Lab User | Type 1 & 2 | |
| WET-C2 | P2-01000 | C2:Oxide Deglaze/PSG Removal | Clean | Qualified Lab User | Type 1 & 2 | |
| WET-C3 | P2-01000 | C3:BOE | Clean | Qualified Lab User | Type 1 & 2 | |
| SRD-C | P2-01000 | Spin Dryer-C | Clean | Qualified Lab User | Type 1 & 2 | |
| Wetstation D - Semi-Clean Metal Processing Station | ||||||
| WET-D1 | P2-01000 | D1:Aluminum Etch | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| WET-D2 | P2-01000 | D2:HF:H2O(1:100) MILC | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| WET-D3 | P2-01000 | D3:General Purpose | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| WET-D4 | P2-01000 | D4:Sulfuric Cleaning for MILC | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| SRD-D | P2-01000 | Spin Dryer-D | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| Wetstaton E - Semi-Clean Non-metal Processing Station | ||||||
| WET-E1 | P2-01000 | E1:ITO Etch | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| WET-E2 | P2-01000 | E2:General Purpose | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| WET-E3 | P2-01000 | E3:HF:H2O(1:100) | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| WET-E4 | P2-01000 | E4:Resist Strip | Clean/Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| SRD-E | P2-01000 | Spin Dryer-E | Clean/Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| Wetstation F - Non-Standard Processing Station | ||||||
| WET-F1 | P2-01000 | F1:General Purpose | Non-Standard | Qualified Lab User | Type 1 & 2 | |
| WET-F2 | P2-01000 | F2:General Purpose | Non-Standard | Qualified Lab User | Type 1 & 2 | |
| WET-F3 | P2-01000 | F3:General Purpose | Non-Standard | Qualified Lab User | Type 1 & 2 | |
| SRD-F | P2-01000 | Spin Dryer-F | Non-Standard | Qualified Lab User | Type 1 & 2 | |
| Wetstation G - TMAH Etching Station | ||||||
| WET-G1 | P2-01000 | G1:TMAH | Clean | Qualified Lab User | Type 1 & 2 | |
| WET-G2 | P2-01000 | G2:TMAH | Clean | Qualified Lab User | Type 1 & 2 | |
| SRD-G | P2-01000 | Spin Dryer-G | Clean | Qualified Lab User | Type 1 & 2 | |
| Wetstation J - TMAH/KOH Etching Station | ||||||
| WET-J1 | P2-01000 | J1:TMAH/KOH Etching | Non-Standard | Qualified Lab User | Type 1 & 2 | |
| WET-J2 | P2-01000 | J2:TMAH/KOH Etching | Non-Standard | Qualified Lab User | Type 1 & 2 | |
Wetstation M - Non-Standard Organic Solvent Station |
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WET-M1 |
EC-01000 |
M1:MS2001 Resist Strip |
Non-Standard |
Qualified Lab User | Type 1 & 2 | |
WET-M2 |
EC-01000 |
Branson 5510 |
Non-Standard |
Qualified Lab User | Type 1 & 2 | |
WET-M3 |
EC-01000 |
M3:MS2001 Mask Cleaning |
Non-Standard |
Qualified Lab User | Type 1 & 2 | |
Wetstation O - Non-Standard Hydrochloric Acid Etch Station |
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WET-O1 |
EC-01000 |
O1: HCl |
Non-Standard |
Qualified Lab User | Type 1 & 2 | |
| Wetstation W - Non-Standard Organic Solvent Station | ||||||
| WET-W1 | P2-00100 | W1:MS2001 Resist Strip | Non-Standard | Qualified Lab User | Type 1 & 2 | |
| WET-W2 | P2-00100 | W2:FHD-5 | Non-Standard | Qualified Lab User | Type 1 & 2 | |
| SRD-W | P2-00100 | Spin Dryer-W | Non-Standard | Qualified Lab User | Type 1 & 2 | |
| Wetstation X - Clean Organic Solvent Station | ||||||
| WET-X1 | P2-00100 | X1:General Purpose | Clean | Qualified Lab User | Type 1 & 2 | |
| WET-X2 | P2-00100 | X2:General Purpose | Clean | Qualified Lab User | Type 1 & 2 | |
| Wetstation Y - Semi-Clean Organic Solvent Station | ||||||
| WET-Y1 | P2-00100 | Y1:MS2001 Resist Strip | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| WET-Y2 | P2-00100 | Y2:MS2001 Mask Cleaning | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| SRD-Y | P2-00100 | Spin Dryer-Y | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| Wetstation Z - Semi-Clean/Non-Standard Organic Solvent Station | ||||||
| WET-Z1 | P2-00100 | Z1:FHD-5 | Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| WET-Z2 | P2-00100 | Z2:Dump Rinser | Semi-Clean/Non-Standard | Qualified Lab User | Type 1 & 2 | |
Critical Point Dryer |
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CPD-1 |
NDL-10000 |
Critical Point Dryer |
Semi-Clean |
Qualified Lab User | Type 1 & 3 | |
Electroplating |
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EP-1 |
Rm. 2227 |
Copper Electroplating |
Non-Standard |
Staff | NA | |
4. Photolithography Module
Process
code |
Location |
Equipmment |
Cleanliness Level |
Who operates |
Training type |
Remark |
| Ultrasonic Bath | ||||||
| PHT-U1 | P2-00100 | Branson 5510 | Semi-Clean | Qualified Lab User | NA | |
| PHT-U2 | P2-00100 | Branson 3510 | Non-Standard | Qualified Lab User | NA | |
| Stepper/Aligner and Bonder | ||||||
| PHT-A7 | P2-00100 | Karl Suss MA6 #2 | Clean/Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| PHT-S1 | P2-00100 | ASML Stepper | Clean/Semi-Clean | Staff | NA | |
PHT-A1 |
NDL-10000 |
AB-M Aligner #1(UV)/(DUV) |
Semi-Clean/Non-Standard |
Qualified Lab User | Type 1 & 2 | |
| PHT-A2 | P2-00100 | AB-M Aligner #2(UV) | Semi-Clean/Non-Standard | Qualified Lab User | Type 1 & 2 | |
PHT-A5 |
EC-01000 |
Karl Suss MA6 #1 |
Non-Standard |
Qualified Lab User | Type 1 & 2 | |
| PHT-B2 | P2-00100 | Karl Suss Bonder XB8 | Non-Standard | Staff | NA | |
| PHT-B3 | P2-00100 | SET ACCµRA100 Flip-Chip Bonder | Non-Standard | Staff | NA | |
EMW-1 |
EC-01000 |
JEOL JBX-6300FS E-Beam Lithography System |
All Level |
Staff | NA | |
| PHT-P1 | P2-01000 | Nanoscribe 3D Printer | All Level | Qualified Lab User | Type 3 | |
| Coater and Track | ||||||
| PHT-T1 | P2-00100 | SVG88 Coater Track | Clean/Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| PHT-T2 | P2-00100 | SVG88 Developer Track | Clean/Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| PHT-SC3 | P2-00100 | CEE Coater | Clean/Semi-Clean | Qualified Lab User | Type 1 & 2 | |
| PHT-SC1 | P2-00100 | SUSS Coater | Semi-Clean/Non-Standard | Qualified Lab User | Type 1 & 2 | |
| PHT-SC2 | P2-00100 | Desktop Coater | Non-Standard | Qualified Lab User | Type 1 & 2 | |
| PHT-SC5 | P2-00100 | EVG Spray Coater | All Level | Qualified Lab User | Type 1 & 2 | |
PHT-SC4 |
EC-01000 |
Solitec Coater #1 |
Non-Standard |
Qualified Lab User | Type 1 & 2 | |
PHT-SC6 |
P2-01000 |
Laurell PDMS Coater |
Non-Standard |
Qualified Lab User | Type 1 & 2 | Microfluidic user only |
PHT-MX1 |
P2-01000 |
Kurabo PDMS Mixer/Deaerator |
Non-Standard |
Qualified Lab User | Type 1 & 2 | Microfluidic user only |
| Oven | ||||||
| PHT-O3 | P2-00100 | Imperial V (105C) | Clean/Semi-Clean | Qualified Lab User | NA | |
| PHT-O4 | P2-00100 | Oven-C (120C) | Clean/Semi-Clean | Qualified Lab User | NA | |
| PHT-O6 | P2-00100 | Oven-A (180C) | Clean/Semi-Clean | Qualified Lab User | NA | |
| PHT-O7 | P2-00100 | Oven-B (80C) | Clean/Semi-Clean | Qualified Lab User | NA | |
| PHT-O1 | P2-00100 | Grieve | Non-Standard | Qualified Lab User | NA | |
| PHT-O2 | P2-00100 | Shellab (120C) | Non-Standard | Qualified Lab User | NA | |
| PHT-O5 | P2-00100 | Vacuum Oven | Non-Standard | Qualified Lab User | Type 1 & 2 | |
PHT-O8 |
EC-01000 |
Oven-D (120C) |
Non-Standard |
Qualified Lab User | NA | |
PHT-O9 |
EC-01000 |
Oven-E (105C) |
Non-Standard |
Qualified Lab User | NA | |
PHT-O10 |
P2-01000 |
Oven-F (80C) |
Non-Standard |
Qualified Lab User | NA | Microfluidic user only |
| PHT-O11 | P2-01000 | Unitemp Reflow Oven | Non-Standard | Qualified Lab User | Type 1 & 2 | Flip Chip user only |
| Hotplate | ||||||
| PHT-HP1 | P2-00100 | Sawatec Hot Plate | Clean/Semi-Clean | Qualified Lab User | NA | |
| PHT-HP2 | P2-00100 | SUSS Hot Plate | Clean/Semi-Clean | Qualified Lab User | NA | |
| PHT-HP9 | P2-00100 | CEE Hot Plate #1(110C) | Clean/Semi-Clean | Qualified Lab User | NA | |
| PHT-HP3 | P2-00100 | Hot Plate-C | Non-Standard | Qualified Lab User | NA | |
| PHT-HP4 | P2-00100 | Hot Plate-D | Non-Standard | Qualified Lab User | NA | |
PHT-HP5 |
EC-01000 |
EMS Hot Plate #1 (50C) |
Non-Standard |
Qualified Lab User | NA | |
PHT-HP6 |
EC-01000 |
CEE Hot Plate #2 (90C) |
Non-Standard |
Qualified Lab User | NA | |
PHT-HP7 |
EC-01000 |
Hot Plate (110C) |
Non-Standard |
Qualified Lab User | NA | |
| PHT-HP8 | P2-00100 | EMS Hot Plate #2 (50C) | Non-Standard | Qualified Lab User | NA | |
| HMDS Primer | ||||||
| PHT-HM1 | P2-00100 | HMDS Primer #1 | Non-Standard | Qualified Lab User | NA | |
| PHT-HM2 | P2-00100 | HMDS Primer #2 | Clean/Semi-Clean | Qualified Lab User | NA | |
PHT-HM3 |
EC-01000 |
HMDS Primer #3 |
Non-Standard |
Qualified Lab User | NA | |