工藝資訊

Cleanliness Levels of NFF (CWB) Equipment (Click HERE to download)

 

1.      Thermal Diffusion and Implantation Module

2.      Dry Etching and Sputtering Module

3.      Wet Etching and CMP Module

4.      Photolithography Module

 

Remark:

 Blue : Equipment in NFF (CWB)-EC (EC-01000)

 Black : Equipment in NFF (CWB)-Phase 2 (P2-01000 and P2-00100)

 Green: Equipment in TSV Process Laboratory (Rm. 2227)

 Red: Equipment in Deep RIE Process Center (Rm. 2223)

 Brown: Equipment for Microfluidic Process in NFF (CWB)-Phase 2

 Purple: Equipment in Nanofabrication Demonstration Laboratory (NDL) (Rm. 3114)

 

Training Type 1: Peer-to-peer training

Training Type 2: Self-learning with practice

Training Type 3: Training class

 

1.      Thermal Diffusion and Implantation Module

Process code
Location
Equipment 
Cleanliness level
Who operates
Training type
Cleaning
CVD
CVD-A2 P2-01000 LPCVD-A2 Doped Amor-Si Clean Staff NA A3+SRD-A
CVD-A3 P2-01000 LPCVD-A3  Amor-Si/Poly Clean Staff NA A3+SRD-A 
CVD-B1 P2-01000 LPCVD-B1 Low-Stress Nitride Clean Staff NA A3+SRD-A 
CVD-B2 P2-01000 LPCVD-B2 Nitride Clean Staff NA A3+SRD-A 
CVD-B3 P2-01000 LPCVD-B3 LTO  Clean Staff NA A3+SRD-A
CVD-EPI P2-01000 ET3000 Epitaxy Clean Staff NA A3+SRD-A
CVD-A4 P2-01000 LPCVD-A4  Si-Ge / Amor-Si / Poly Semi-Clean Staff NA B1+SRD-B
D1 (dump-rinser)
CVD-B4 P2-01000 LPCVD-B4 LTO / PSG Semi-Clean Staff NA B1+SRD-B
D1 (dump-rinser)
CVD-P3 P2-01000 Oxford PECVD Semi-Clean Qualified Lab User Type 1 & 3 B1+SRD-B
D1 (dump-rinser)
CVD-P2 P2-01000 STS PECVD Non-Standard Qualified Lab User Type 1 &2 B1+SRD-B/D1 (dump-rinser)/F (dump-rinser)
CVD-CNT P2-01000 CNT PECVD Non-Standard Qualified Lab User Type 1 & 3 B1+SRD-B/D1 (dump-rinser)/F (dump-rinser)
CVD-ALD P2-01000 Oxford ALD Non-Standard Qualified Lab User Type 1 & 3 B1+SRD-B/D1 (dump-rinser)/F (dump-rinser)
Thermal Diffusion
DIF-C1 P2-01000 Diff. Furnace-C1 FGA Annealing Non-Standard Staff NA B1+SRD-B/D1 (dump-rinser)/F (dump-rinser)
DIF-C2 P2-01000 Diff. Furnace-C2 N Pre-Deposition Clean Staff NA A3+SRD-A
DIF-C3 P2-01000 Diff. Furnace-C3 P Pre-Deposition Clean Staff NA A3+SRD-A
DIF-D1 P2-01000 Diff. Furnace-D1 Dry Oxidation Clean (Only for gate oxide) Staff NA A3+SRD-A 
DIF-A1 P2-01000 Diff. Furnace-A1 Anneal/Oxidation Clean  Staff NA A3+SRD-A
DIF-D2 P2-01000 Diff. Furnace-D2 Dry/Wet Oxidation Clean Staff NA A3+SRD-A
DIF-D3 P2-01000 Diff. Furnace-D3 Annealing/Dry/Wet Oxidation Non-Standard Staff NA B1+SRD-B/D1 (dump-rinser)/F (dump-rinser)
DIF-R1 P2-01000 RTP-600S Clean Qualified Lab User Type 1 & 3 A3+SRD- A
DIF-F1 P2-01000 Diff. Furnace-F1 Annealing/Dry/Wet Oxidation Semi-Clean Staff NA B1+SRD-B
D1 (dump-rinser)
DIF-C4 P2-01000 Diff. Furnace-C4 FGA Annealing Semi-Clean Staff NA B1+SRD-B
D1 (dump-rinser)
DIF-R2 P2-01000 AG610 RTP Semi-Clean Qualified Lab User Type 1 & 3 B1+SRD-B
D1 (dump-rinser)

DIF-R3

EC-01000

AW610 RTP

Non-Standard

Qualified Lab User Type 1 & 3

M1(dump-rinser)+ N2 dry

Implantation
IMP-3000 P2-01000 CF-3000 Implanter Clean/Semi-Clean Staff NA  

 

2.      Dry Etching and Sputtering Module

* Remark: For Semi-Clean process of "Poly Etcher", please contact NFF (CWB) technicians.
* Remark: For Semi-Clean process of "Oxford GaN-InP Etcher", please contact NFF(CWB) technicians.
Process code
Location
Equipment 
Cleanliness level
Who operates
Training type
Cleaning
Dry Etching
DRY-AOE P2-01000 AOE Etcher Clean Qualified Lab User Type 1 & 3  
DRY-Si-1 P2-01000 DRIE Etcher #1 Clean Qualified Lab User Type 1 & 3  

DRY-Si-2

Rm. 2223

DRIE Etcher #2

Clean/Semi-Clean

Qualified Lab User Type 3  

DRY-Si-3

Rm. 2223

DRIE Etcher #3

Non-Standard

Qualified Lab User Type 3  
DRY-Poly P2-01000 Poly Etcher Clean/Semi-Clean * Qualified Lab User Type 1 & 3  
DRY-XeF2 P2-01000 XeF2 Silicon Etcher Clean/Semi-Clean Qualified Lab User Type 1 & 3  
DRY-Trion P2-01000 Trion RIE Etcher Semi-Clean Qualified Lab User Type 1 & 2  
DRY-Metal-1 P2-01000 AST Metal Etcher Semi-Clean Qualified Lab User Type 3  
DRY-Metal-2 P2-01000 Oxford  Aluminum Etcher Semi-Clean Qualified Lab User Type 3  
DRY-GaN P2-01000 GaN Etcher Non-Standard Qualified Lab User Type 1 & 3  
DRY-GaN-2 P2-01000 Oxford GaN-InP Etcher Semi-Clean * Qualified Lab User Type 1 & 3  

DRY-RIE-1

EC-01000

Oxford RIE Etcher

Non-Standard

Qualified Lab User Type 1 & 3  
DRY-RIE-2 P2-01000 NFF RIE Etcher Semi-Clean Qualified Lab User Type 1 & 3  

DRY-Cleaner

P2-01000

Diener Plasma Cleaner

Non-Standard

Qualified Lab User Type 1 & 2

Microfluidic user only

Photoresist O2 Asher
DRY-PR-1 P2-01000 PS210 Asher Clean Qualified Lab User Type 1 & 2  
DRY-PR-2 P2-01000 IPC 3000  Asher #1 Semi-Clean Qualified Lab User Type 1 & 2  
DRY-PR-3 P2-01000 IPC 3000  Asher #2 Non-Standard Qualified Lab User Type 1 & 2  

DRY-PR-4

EC-01000

IPC 3000  Asher #3

Non-Standard

Qualified Lab User Type 1 & 2  
DRY-PR-5 P2-01000 IPC 3000  Asher #4 Clean Qualified Lab User Type 1 & 2  
Sputtering & Evaporation
SPT-3180 P2-01000 Varian 3180 Sputter Semi-Clean Staff NA  
SPT-NSC3000 P2-01000 NSC3000 Sputter Semi-Clean Qualified Lab User Type 1 & 3  
SPT-CY1 P2-01000 NFF-CY Sputter #1 Semi-Clean Qualified Lab User Type 1 & 3  

SPT-EV1

NDL-10000

Cooke Evaporator #1

Semi-Clean

Qualified Lab User Type 1 & 3  
SPT-ARC P2-01000 ARC-12M Sputter Non-Standard Qualified Lab User Type 1 & 3  
SPT-CVC P2-01000 CVC-601 Sputter Non-Standard Qualified Lab User Type 1 & 3  

SPT-EV2

EC-01000

Cooke Evaporator #2

Non-Standard

Qualified Lab User Type 1 & 3  

SPT-AST600

EC-01000

AST 600EI  Evaporator

Non-Standard

Qualified Lab User Type 1 & 3  

SPT-AST450

EC-01000

AST 450I Evaporator

Non-Standard

Qualified Lab User Type 1 & 3  

 

3.     Wet Etching and CMP Module

Process code
Location
Equipmment 
Cleanliness Level
Who operates
Training type
Remark
CMP
CMP-2 P2-10000 USI Wafer Cleaner Clean      

CMP-3

Rm. 2227

Silicon Grinder

Semi-Clean

Qualified Lab User Type 1 & 2  

CMP-4

Rm. 2227

Buehler Polisher #1

Semi-Clean

Qualified Lab User Type 1 & 2  

CMP-5

Rm. 2227

Buehler Polisher #2

Non-Standard

Qualified Lab User Type 1 & 2  

CMP-6

NDL-10000

GnP CMP

Clean

Staff NA  
Wet-station
Wetstation A - Sulfuric Cleaning Station
WET-A1 P2-01000 A1: Sulfuric Cleaning (NFF reserved) Clean  Qualified Lab User Type 1 & 2  
WET-A2 P2-01000 A2:HF:H20 (1:50)  Clean  Qualified Lab User Type 1 & 2  
WET-A3 P2-01000 A3: Sulfuric Cleaning  Clean  Qualified Lab User Type 1 & 2 ONLY for "Clean" furnace and RTP
SRD-A P2-01000 Spin Dryer-A Clean  Qualified Lab User Type 1 & 2  
Wetstation B - Sulfuic Cleaning/Decontamination Station
WET-B1 P2-01000 B1:Sulfuric Cleaning Clean Qualified Lab User Type 1 & 2 NOT for "Clean" furnace and RTP
WET-B2 P2-01000 B2:HF:H20(1:50) Clean Qualified Lab User Type 1 & 2  
WET-B3 P2-01000 B3:Decontamination Clean Qualified Lab User Type 1 & 2  
SRD-B P2-01000 Spin Dryer-B Clean  Qualified Lab User Type 1 & 2  
Wetstation C - Oxide/Nitride Etching Station
WET-C1 P2-01000 C1:Nitride Strip Clean Qualified Lab User Type 1 & 2  
WET-C2 P2-01000 C2:Oxide Deglaze/PSG Removal Clean Qualified Lab User Type 1 & 2  
WET-C3 P2-01000 C3:BOE Clean Qualified Lab User Type 1 & 2  
SRD-C P2-01000 Spin Dryer-C Clean  Qualified Lab User Type 1 & 2  
Wetstation D - Semi-Clean Metal Processing Station
WET-D1 P2-01000 D1:Aluminum Etch Semi-Clean Qualified Lab User Type 1 & 2  
WET-D2 P2-01000 D2:HF:H2O(1:100) MILC Semi-Clean Qualified Lab User Type 1 & 2  
WET-D3 P2-01000 D3:General Purpose Semi-Clean Qualified Lab User Type 1 & 2  
WET-D4 P2-01000 D4:Sulfuric Cleaning for MILC Semi-Clean Qualified Lab User Type 1 & 2  
SRD-D P2-01000 Spin Dryer-D Semi-Clean Qualified Lab User Type 1 & 2  
Wetstaton E - Semi-Clean Non-metal Processing Station
WET-E1 P2-01000 E1:ITO Etch Semi-Clean Qualified Lab User Type 1 & 2  
WET-E2 P2-01000 E2:General Purpose Semi-Clean Qualified Lab User Type 1 & 2  
WET-E3 P2-01000 E3:HF:H2O(1:100) Semi-Clean Qualified Lab User Type 1 & 2  
WET-E4 P2-01000 E4:Resist Strip Clean/Semi-Clean Qualified Lab User Type 1 & 2  
SRD-E P2-01000 Spin Dryer-E Clean/Semi-Clean Qualified Lab User Type 1 & 2  
Wetstation F - Non-Standard Processing Station
WET-F1 P2-01000 F1:General Purpose Non-Standard Qualified Lab User Type 1 & 2  
WET-F2 P2-01000 F2:General Purpose Non-Standard Qualified Lab User Type 1 & 2  
WET-F3 P2-01000 F3:General Purpose Non-Standard Qualified Lab User Type 1 & 2  
SRD-F P2-01000 Spin Dryer-F Non-Standard Qualified Lab User Type 1 & 2  
Wetstation G - TMAH Etching Station
WET-G1 P2-01000 G1:TMAH Clean Qualified Lab User Type 1 & 2  
WET-G2 P2-01000 G2:TMAH Clean Qualified Lab User Type 1 & 2  
SRD-G P2-01000 Spin Dryer-G Clean  Qualified Lab User Type 1 & 2  
Wetstation J - TMAH/KOH Etching Station
WET-J1 P2-01000 J1:TMAH/KOH Etching Non-Standard Qualified Lab User Type 1 & 2  
WET-J2 P2-01000 J2:TMAH/KOH Etching Non-Standard Qualified Lab User Type 1 & 2  

Wetstation M - Non-Standard Organic Solvent Station

WET-M1

EC-01000

M1:MS2001 Resist Strip

Non-Standard

Qualified Lab User Type 1 & 2  

WET-M2

EC-01000

Branson 5510

Non-Standard

Qualified Lab User Type 1 & 2  

WET-M3

EC-01000

M3:MS2001 Mask Cleaning

Non-Standard

Qualified Lab User Type 1 & 2  

Wetstation O - Non-Standard Hydrochloric Acid Etch Station

WET-O1

EC-01000

O1: HCl

Non-Standard

Qualified Lab User Type 1 & 2  
Wetstation W - Non-Standard Organic Solvent Station
WET-W1 P2-00100 W1:MS2001 Resist Strip Non-Standard Qualified Lab User Type 1 & 2  
WET-W2 P2-00100 W2:FHD-5  Non-Standard Qualified Lab User Type 1 & 2  
SRD-W P2-00100 Spin Dryer-W Non-Standard Qualified Lab User Type 1 & 2  
Wetstation X - Clean Organic Solvent Station
WET-X1 P2-00100 X1:General Purpose Clean Qualified Lab User Type 1 & 2  
WET-X2 P2-00100 X2:General Purpose Clean Qualified Lab User Type 1 & 2  
Wetstation Y - Semi-Clean Organic Solvent Station
WET-Y1 P2-00100 Y1:MS2001 Resist Strip Semi-Clean Qualified Lab User Type 1 & 2  
WET-Y2 P2-00100 Y2:MS2001 Mask Cleaning Semi-Clean Qualified Lab User Type 1 & 2  
SRD-Y P2-00100 Spin Dryer-Y Semi-Clean Qualified Lab User Type 1 & 2  
Wetstation Z - Semi-Clean/Non-Standard Organic Solvent Station
WET-Z1 P2-00100 Z1:FHD-5 Semi-Clean Qualified Lab User Type 1 & 2  
WET-Z2 P2-00100 Z2:Dump Rinser Semi-Clean/Non-Standard Qualified Lab User Type 1 & 2  
Critical Point Dryer

CPD-1

NDL-10000

Critical Point Dryer

Semi-Clean

Qualified Lab User Type 1 & 3  
Electroplating

EP-1

Rm. 2227

Copper Electroplating

Non-Standard

Staff NA  

 

4.      Photolithography Module

Process code
Location
Equipmment 
Cleanliness Level
Who operates
Training type
Remark
Ultrasonic Bath
PHT-U1 P2-00100 Branson 5510 Semi-Clean Qualified Lab User NA  
PHT-U2 P2-00100 Branson 3510 Non-Standard Qualified Lab User NA  
Stepper/Aligner and Bonder
PHT-A7 P2-00100 Karl Suss MA6 #2 Clean/Semi-Clean Qualified Lab User Type 1 & 2  
PHT-S1 P2-00100 ASML Stepper Clean/Semi-Clean Staff NA  

PHT-A1

NDL-10000

AB-M Aligner #1(UV)/(DUV)

Semi-Clean/Non-Standard

Qualified Lab User Type 1 & 2  
PHT-A2 P2-00100 AB-M Aligner #2(UV) Semi-Clean/Non-Standard Qualified Lab User Type 1 & 2  

PHT-A5

EC-01000

Karl Suss MA6 #1

Non-Standard

Qualified Lab User Type 1 & 2  
PHT-B2 P2-00100 Karl Suss Bonder XB8 Non-Standard Staff NA  
PHT-B3 P2-00100 SET ACCµRA100 Flip-Chip Bonder Non-Standard Staff NA  

EMW-1

EC-01000

JEOL JBX-6300FS E-Beam Lithography System

All Level

Staff NA  
PHT-P1 P2-01000 Nanoscribe 3D Printer All Level Qualified Lab User Type 3  
Coater and Track
PHT-T1 P2-00100 SVG88 Coater Track Clean/Semi-Clean Qualified Lab User Type 1 & 2  
PHT-T2 P2-00100 SVG88 Developer Track Clean/Semi-Clean Qualified Lab User Type 1 & 2  
PHT-SC3 P2-00100 CEE Coater  Clean/Semi-Clean Qualified Lab User Type 1 & 2  
PHT-SC1 P2-00100 SUSS Coater Semi-Clean/Non-Standard Qualified Lab User Type 1 & 2  
PHT-SC2 P2-00100 Desktop Coater Non-Standard Qualified Lab User Type 1 & 2  
PHT-SC5 P2-00100 EVG Spray Coater All Level Qualified Lab User Type 1 & 2  

PHT-SC4

EC-01000

Solitec Coater #1

Non-Standard

Qualified Lab User Type 1 & 2  

PHT-SC6

P2-01000

Laurell PDMS Coater

Non-Standard

Qualified Lab User Type 1 & 2

Microfluidic user only

PHT-MX1

P2-01000

Kurabo PDMS Mixer/Deaerator

Non-Standard

Qualified Lab User Type 1 & 2

Microfluidic user only

Oven
PHT-O3 P2-00100 Imperial V (105C) Clean/Semi-Clean Qualified Lab User NA  
PHT-O4 P2-00100 Oven-C (120C) Clean/Semi-Clean Qualified Lab User NA  
PHT-O6 P2-00100 Oven-A (180C) Clean/Semi-Clean Qualified Lab User NA  
PHT-O7 P2-00100 Oven-B (80C) Clean/Semi-Clean Qualified Lab User NA  
PHT-O1 P2-00100 Grieve Non-Standard Qualified Lab User NA  
PHT-O2 P2-00100 Shellab (120C) Non-Standard Qualified Lab User NA  
PHT-O5 P2-00100 Vacuum Oven  Non-Standard Qualified Lab User Type 1 & 2  

PHT-O8

EC-01000

Oven-D (120C)

Non-Standard

Qualified Lab User NA  

PHT-O9

EC-01000

Oven-E (105C)

Non-Standard

Qualified Lab User NA  

PHT-O10

P2-01000

Oven-F (80C)

Non-Standard

Qualified Lab User NA

Microfluidic user only

PHT-O11 P2-01000 Unitemp Reflow Oven   Non-Standard Qualified Lab User Type 1 & 2 Flip Chip user only
Hotplate
PHT-HP1 P2-00100 Sawatec Hot Plate Clean/Semi-Clean Qualified Lab User NA  
PHT-HP2 P2-00100 SUSS Hot Plate Clean/Semi-Clean Qualified Lab User NA  
PHT-HP9 P2-00100 CEE Hot Plate #1(110C) Clean/Semi-Clean Qualified Lab User NA  
PHT-HP3 P2-00100 Hot Plate-C Non-Standard Qualified Lab User NA  
PHT-HP4 P2-00100 Hot Plate-D Non-Standard Qualified Lab User NA  

PHT-HP5

EC-01000

EMS Hot Plate #1 (50C)

Non-Standard

Qualified Lab User NA  

PHT-HP6

EC-01000

CEE Hot Plate #2 (90C)

Non-Standard

Qualified Lab User NA  

PHT-HP7

EC-01000

Hot Plate (110C)

Non-Standard

Qualified Lab User NA  
PHT-HP8 P2-00100 EMS Hot Plate #2 (50C) Non-Standard Qualified Lab User NA  
HMDS Primer
PHT-HM1 P2-00100 HMDS Primer #1 Non-Standard Qualified Lab User NA  
PHT-HM2 P2-00100 HMDS Primer #2 Clean/Semi-Clean Qualified Lab User NA  

PHT-HM3

EC-01000

HMDS Primer #3

Non-Standard

Qualified Lab User NA